Cooling device

ABSTRACT

A cooling device includes a cover, a trough connected to the cover, and a fan circulating air that is received from the sides of the cooling device. The area above the fan is enclosed by the cover. The cooling device also includes a pump for delivering liquid to one or more pads located in the trough.

BACKGROUND

Building spaces, such as office spaces, restaurants, auditoriums,warehouse areas, and manufacturing shop floors may require coolingsystems to provide comfortable temperature and humidity levels toindividuals who are occupying those particular building spaces. However,these existing systems may not be able to provide sufficient cooling andmay require multiple cooling systems or a combination of cooling systemsto provide a comfortable environment.

Outdoor areas, such as patio areas for restaurants, may also use coolingsystems such as fans and evaporative coolers. However, these existingsystems may not be able to provide sufficient cooling and may requiremultiple cooling systems or a combination of cooling systems to providea comfortable environment.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is a diagram of an example environment;

FIGS. 1B and 1C are diagrams of example environments in which systemsand/or methods described herein may be implemented;

FIGS. 2 and 3 are diagrams of an example cooling device;

FIG. 4 is a view of an example cooling device;

FIG. 5 is a view of an example cooling device;

FIG. 6 is a view of an example cooling device;

FIG. 7 is a view of an example cover;

FIG. 8 is another view of an example cover;

FIG. 9 is another view of an example cover;

FIG. 10 is another view of an example cover;

FIG. 11 is a view of an example trough;

FIG. 12 is another view of an example trough;

FIG. 13 is another view of an example trough;

FIG. 14 is another view of an example trough;

FIG. 15 is another view of an example trough;

FIG. 16 is a view of a portion of an example trough;

FIGS. 17 and 18 are diagrams of example piping;

FIG. 19 is a diagram of an example pad;

FIGS. 20 and 21 are diagrams of an example corner;

FIG. 22 is a schematic diagram of various conditions associated with apad;

FIG. 23 is a schematic diagram of a cooling device;

FIGS. 24A and 24B are diagrams of an alternate embodiment of the coolingdevice; and

FIG. 25 is a diagram of an example computing device.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The following detailed description refers to the accompanying drawings.The same reference numbers in different drawings may identify the sameor similar elements.

Systems, devices, and/or methods described herein may allow for acooling device (e.g., a device or a collection of devices) to provide areduction to air temperature within a particular area/space. Inembodiments, the device may include a fan which operates with anevaporating cooling system to reduce air temperature. In embodiments,the installation of the cooling device may reduce the need for multiplecooling systems to condition the same amount of area. For example, apatio area of a restaurant may require a single cooling device, insteadof multiple cooling devices, to reduce the air temperature level andallow restaurant customers to sit in an area with a cooler temperaturelevel.

FIG. 1A describes an example of an individual sitting in an outside(e.g., an exterior area outside a building) patio area. To provide thecomfortable temperature levels desired by the restaurant customers, therestaurant may have to install an outdoor ceiling fan 101 whichcirculates air from above the fan. However, since the ceiling fan onlymoves air, the ceiling fan is limited in how much cooling it can provideto the restaurant customers sitting in the patio area. Thus, therestaurant owners may also have to install evaporative cooling systems102 which can be placed on ground. Evaporative cooling systems 102 maybe able to cool the air temperature in the patio area, but they generatean airstream that includes a mist (e.g., haze, fog like appearance,etc.) into the patio area. While the comfort level in the patio area maybe improved, the additional systems take up additional space on thepatio area floor. As such, the restaurant owners are spending additionalmoney on the evaporative coolers and also losing money because there isless patio space for additional customers. Furthermore, as theadditional evaporative coolers are mechanical devices, the evaporativecoolers are not aesthetically pleasing to view and, thus, reduce theenjoyment experience of the restaurant customers.

In contrast, the device and/or systems described herein overcome thedeficiencies shown in FIG. 1A. As shown in FIG. 1B, cooling device 200is attached to the ceiling of the patio area and provides cooling to thepatio area. Since cooling device 200 incorporates evaporative coolingsystems, it is unnecessary to install the multiple cooling systemsdescribed in FIG. 1A. As shown in FIG. 1B, air initially enters coolingdevice 200 from the sides of cooling device 200 and not from abovecooling device 200. In contrast, in this example, ceiling fan 101obtains air from above ceiling fan 101. Thus, as shown in FIG. 1B, thereare no evaporative coolers taking up valuable patio flooring space.Instead, the restaurant owner, in this example, can now place decorativeplants that improve the visual experience of the patio area.Furthermore, the air that is supplied by cooling device 200 does notinclude any visible mist, hazy, or fog-like appearance. FIG. 1C showscooling device 200 as attached to a side wall instead of the ceiling.While not shown, instead of connecting directly to a ceiling or wall,cooling device 200 may connect from a structure that connects to aceiling or wall. Furthermore, cooling device 200 may connect at an angleto a part of a building structure (e.g., ceiling, wall, etc.).

Thus, restaurant customers are able to enjoy the experience of eating ina temperature controlled patio area without the need to place multiplemechanical devices within the restaurant customer's surroundings.Furthermore, the restaurant owner, another type of business, or aresidential user, does not have to: (i) purchase and use different typesof cooling systems at the same time, (ii) maintain different types ofcooling systems, and/or (iii) sacrifice valuable commercial orresidential space for mechanical equipment. While the cooling device, orsystems, have been described within the context of a restaurant, thecooling device (e.g. cooling device 200) may be used in other types ofsettings, such as in a residential home, interior spaces, other types ofexterior spaces (e.g., picnic areas, outside work areas—farmingactivities, etc.), and/or any other space that may require a coolingdevice.

As a result, cooling device 200, provides desired temperature levelswithout having to install multiple different devices, such as fans,evaporative coolers, and/or other types of cooling devices for the samearea to be cooled. Furthermore, cooling device 200 does not generate anysupplied air with mist, haze, a fog-like appearance, etc. Becausemultiple different types of devices are not installed, there is areduction in costs associated with purchasing and maintenance. Instead,one or more cooling devices 200 can be purchased and used to provide thedesired temperature levels. Furthermore, the reduction in other types ofdevices may also increase the flooring area to install decorativeproducts (e.g., plants, statues), tables, barbeque system, manufacturingmachines, and/or other items.

FIG. 2 is a diagram of example cooling device 200. FIG. 2 shows fan 202,cover 204, trough 206, connector 208, and pad 302 which is described inlater figures.

Fan 202 may be a device that rotates in a circular or ellipticalfashion. In embodiments, fan 202 may have one or more blades, whichextend from a central hub of fan 202, that rotate when mechanical poweris provided to fan 202 via the central hub which may include a motor(e.g., electrical, mechanical, etc.) to rotate the one or more blades.While blades are described, the blades may also be known as paddles orby any other name. In embodiments, fan 202 may force, i.e., push, air ina particular direction. For example, if cooling device 200 is mountedfrom a ceiling, fan 202 may push air downwards and across the area belowthe ceiling. Alternatively, for example, if cooling device 200 ismounted on a side wall (e.g., a vertical wall of a building), fan 2002may push air across a particular area. In embodiments, fan 202 may pushair (as shown as “incoming air” in FIG. 2) that has initially passedthrough pads, such as pads 302. In embodiments, fan 202 may be avariable speed driven fan or may be a constant speed driven fan. Inembodiments, the blades of fan 202 may be manufactured from a metalmaterial, a plastic material, or a hybrid material. In embodiments, fan202 may have a motor size and blade dimensions that allow for minimizingnoise, power requirements, vibration effects, and sizing of cover 204,trough 206, and pads 302 (as described in further drawings).

Cover 204 may be a cover that prevents air from being drawn in by thefan from across the surface upon which cover 204 is placed upon. Inembodiments, cover 204 may be made from a metal material (e.g.,aluminum, steel, copper, bronze, etc.), a plastic material, or a hybridmaterial. In embodiments, cover 204 may be non-transparent (as shown inFIG. 2) or may be transparent (as shown in FIG. 3). In embodiments,cover 204 may be octagonal, circular, rectangular, square, hexagonal,and/or any other shape. In embodiments, as shown in FIG. 2, an octagonalshape may allow for rectangular cuboid shaped pads 204 to be used. Inalternate embodiments, a circular shaped cover 204 may allow forcurved-shaped pads. In further alternate embodiments, cover 204 mayinclude openings, passageways, slots of any shape, etc., that allow forair to enter from cover 204 and into circulation by fan 202 insidecooling device 200.

Trough 206 may be structure that may store liquid and may also providefor ducting of air exiting cooling device 200. In embodiments, trough206 may be made from a metal material (e.g., aluminum, steel, galvanizedsteel, copper, bronze, etc.), a plastic material, or a hybrid material.In embodiments, trough 206 may be created by connecting multipletrough-shaped components (as further described in FIGS. 15 and 16). Inalternate embodiments, trough 206 may be manufactured as one continuousstructure. In embodiments, trough 206 may hold any liquid that maydrip/move from pad 302 that has not evaporated. In embodiments, trough206 may be used as a duct for incoming air to be forced through coolingdevice 200. In further embodiments, the shape of trough 206 (as furtherdescribed in FIGS. 15 and 16) allows for the dimension “S,” as shown inFIG. 2, of cooling device 200 to be reduced and, thus, reducing theamount of space taken up by cooling device 200. While cover 204 andtrough 206 may be separate manufactured components that connect together(as described in further figures), in alternate embodiments, cover 204and trough 206 may be a single manufactured component. Connector 208 mayconnect cover 204 to trough 206.

In embodiments, connector 208 may be a t-slotted bar (e.g., 80/20 longor short) that fits into apertures (e.g., holes, openings, etc.) withincover 204 and trough 206. In alternate embodiments, connector 208 may bea non-slotted bar.

FIG. 3 shows another example diagram of cooling device 200. In FIG. 3,cover 204 may be manufactured from a transparent material and allows forthe internal components that make up cooling device 200 to be visiblefrom a particular perspective view. As shown in FIG. 3, cooling device200 includes fan 202, bracket 203, piping 214, cover 204, and pad 302which is further described in FIG. 12. In embodiments, piping 214 isalso described in further figures. In embodiments, bracket 203 may beused to connect cover 204 to trough 206 by using connectors, such asconnector 306 (shown in FIG. 11).

FIG. 4 shows a view of cooling device 200 when being viewed from theside of cooling device 200 where cover 204 is located. From this view,the central hub of fan 202 is visible. In embodiments and from thisview, connector 208 is also visible.

FIG. 5 shows another view of cooling device 200 when being viewed fromthe area to which fan 202 will be forcing conditioned air. From thisview, the blades of fan 202 are visible and a portion of cover 204 isvisible when viewing from the side that shows the blades of the fan 202that can circulate in a space created by trough 206 within coolingdevice 200. FIG. 5 also shows connecting rods 207. In embodiments,connecting rods 207 connect fan 202 to trough 206 to provide stabilityto fan 202 during rotation. In alternate embodiments, cooling device 200may not have any connecting rods 207

FIG. 6 shows another view of cooling device 200 when being viewed fromthe sides of cooling device 200 from where air will enter cooling device200. In embodiments, FIG. 6 shows fan 202, cover 204, trough 206,connector 208, pad cover 210, and pad 302. In embodiments, there may oneor more pad covers 210 as there may be one or more pads 302. Inembodiments, pad cover 210 may be a sheet of material, connected tocover 204 (e.g., welded, via a hinge, bolted on, etc.), that may be usedto keep pad 302 within trough 206. In alternate embodiments, pad cover210 may be used to conceal part or all of pad 302 from external view.Thus, for example, if cooling device 200 is attached from a ceiling andcover 204 is closest to the ceiling, pad cover 210 may conceal a portionof pad 302 that is furthest from the ground. In alternate embodiments,pad cover 210 may be attached to trough 206 instead of being connectedto cover 204. Thus, for example, if cooling device 200 is attached froma ceiling and cover 204 is closest to the ceiling, pad cover 210 mayconceal the portion of pad 302 that is closest to the ground. Inembodiments, pad cover 210 may be cover about 20 to 100% of the surfaceof a particular pad 302.

In embodiments, the blades of fan 202 may extend below trough 206. Forexample, if cooling device 200 is mounted from a ceiling, the blades offan 202 will be closer to the floor than the lower portion of trough206. In alternate embodiments, the blades of fan 202 may be at the samelevel as the lower portion of trough 206. For example, if cooling device200 is mounted from a ceiling, the lower portion of trough 206 will beat the same level as the blades of fan 202. In further embodiments, theblades of fan 202 may be less than the level of the lower portion oftrough 206. For example, if cooling device 200 is mounted from aceiling, the lower portion of trough 206 will be closer to the floorthan the blades of fan 202.

FIG. 7 shows a view of cover 204 when being viewed from a particularview (e.g., a top view as if viewing from a room ceiling). FIG. 8 showsanother view of cover 204 when being viewed from another particular view(e.g., as if looking up towards a ceiling). In embodiments, FIG. 8 showspad covers 210, pump cover 212, and piping 214. In embodiments, piping214 provide liquid (e.g., water) to each pad 302 that is within coolingdevice 200. In embodiments, piping 214 may be traverse along one or moreof the sides of cover 204 and may be attached to cover 204 via one ormore connection devices. In embodiments, piping 214 may have a portionthat is connected to a liquid supply device (e.g., a pump) that may be apart of cooling device 200 or may be a separate device from coolingdevice 200. In embodiments, piping 214 may release liquid as a spray,jet, or sprinkle, from one or more openings, across the surface ofpiping 214, over one or more surfaces of pad 302. In embodiments, liquidopenings on the surface of piping 214 may have nozzles or another devicethat can adjust the amount of liquid being transferred to each pad 302.In embodiments, piping 214 may be tubes that are connected with eachother (e.g., using elbow connectors). In alternate embodiments, piping214 may be manufactured as a single device without the need forconnectors. In alternate embodiments, piping 214 may be attached tosections of trough 206 that are closest to cover 204. In furtheralternate embodiments, pad cover 210 and pump cover 212 may be attachedto trough 206 instead of being connected to cover 204. In embodiments,piping 214 may be connected to a pump system. In embodiments, the pumpsystem may be controlled by a computing device, as described in FIG. 24.In embodiments, the pump system may be a dry pump system. Inembodiments, some of the liquid that is supplied to pads 302 may betransfer to trough 206. In embodiments, trough 206 may include a floatvalve, or other device, that detects the amount of liquid in trough 206.In embodiments, if the amount of liquid in trough 206 exceeds a certainthreshold (e.g., by weight, by water level, by cubic feet, etc.), thepump may operate and provide liquid supply, via piping 214, to pads 302.In embodiments, the threshold may be determined by a measuringinstrument attached to trough 206 and controlled by a computing deviceas described in FIG. 25. In embodiments, some of the liquid in trough206 may be pumped out of trough 206 and redistributed back to pads 302.In embodiments, when the amount of liquid does not exceed a threshold,the pump may not operate and, accordingly, may not provide liquid topads 302 via piping 214.

FIG. 9 shows another view of cover 204 (e.g., a side view). Inembodiments, FIG. 9 shows cover 204 with connector 208, pad covers 210,pump cover 212, and piping 214. FIG. 10 also shows another view of cover204. In embodiments, FIG. 10 shows cover 204 with connector 208, padcovers 210, pump cover 212, and piping 214. As shown in FIGS. 9 and 10,pad covers 210 have a smaller height than pump cover 212. In alternateembodiments, pad cover 210 may be the same height as pump cover 212 ormay be of greater height than pump cover 212.

FIG. 11 shows a perspective view of cooling device 200 without cover204. In embodiments, FIG. 11 shows fan 202, trough 206, connector 208,pad 302, corner 304, connector 306, connector 308, and pump connector310. FIG. 12 shows the same perspective view of cooling device 200 asFIG. 11; however, FIG. 12 further shows connector 312, and washer plate314.

In embodiments, pad 302 may be made from a cellulose material,fiberglass, or grass material, that allows for receiving liquid (e.g.,water). In embodiments, pad 302 may be made from a rigid material or aflexible material. In embodiments, pad 302 may sit in trough 206 withoutany connecting device being inserted into pad 302. In embodiments, pad302 may be a shape with all linear sides, with some linear sides andsome curved sides, and/or with all curved sides. In embodiments, fan 202forces air through each pad 302. As such, evaporation of the liquid ineach pad 302 occurs based on the forced air from fan 202. Accordingly,the evaporation of the liquid results in air that has passed over andthrough the pads to be cooler than when they entered cooling device 200.In embodiments, liquid, such as water, may evaporate from each pad 302at a particular range. As such, the evaporation of liquid from each pad302 prevents any issues with mist. Furthermore, the change intemperature of air moved over pad 302 is less than when the airtemperature prior to moving over pad 302 based on the evaporation ofliquid from pad 302. Thus, for example, if air enters pad 302 at 85degrees Fahrenheit, the air may exit pad 302 at 77 to 78 degreesFahrenheit.

In embodiments, corner 304 may be used to create an area within trough206 to place a pad 302. In embodiments, corner 304 may be attached totrough 206 with connectors, as further described in other figures.

In embodiments, connector 306 may be used to connect trough 206 withcover 204. In embodiments, connector 308 may also be used to connecttrough 206 with cover 204. In embodiments, connectors 306 and 308 mayboth be types of a t-slotted bar (80/20).

In embodiments, pump connector 310 may be used to connect water pipingwith a pump. While not shown in the figures, a pump may be a part ofcooling device 200 and may be located totally or partially within trough206. Alternatively, the pump may be a separate device that is notlocated within cooling device 200 and may operate based on receivingmeasurement information from one or more measuring devices locatedwithin trough 206.

In embodiments, connector 312 may be used to maintain pad 302's positionwithin trough 206. In embodiments, connector 312 may be made of metal,plastic, or a hybrid material.

In embodiments, washer plates 314 may be used to connect corner 304 totrough 206 and also may be used to connect connectors 306 and 308 totrough 206.

FIG. 13 shows a perspective view of how connectors 306, connectors 308,and connectors 312 are located around trough 206. FIG. 14 shows anotherview of how connectors 306 and connectors 312 are located around trough206 and their relationship to each other. In embodiments, the distancebetween connectors 312 provide a length sufficient to fit pad 302 sothat 302 will not fall out of trough 206. For example, if the length ofpad 302 is 14 inches, the connectors 312 may be located about 14 to 14.1inches. In embodiments, connectors 306 and 308 are located throughouttrough 206

FIG. 15 shows another example of trough 206. As shown in FIG. 15, thisexample of trough 206 shows trough 206 as being made up of multipleparts, such as part 206A and 206B. In embodiments, each part, such aspart 206A and 206B may be connected to each other (e.g., by welding,soldering, gluing, etc.) to create trough 206. In embodiments, trough206 may include illuminating devices (e.g., lights, reflectors, etc.)that may be located on the portion of trough 206 that is furthest fromcover 204. Thus, if cooling device 200 is used when there is little orno sunlight present, cooling device 200 can also provide illumination inan area, such as an outside patio area.

FIG. 16 shows a view of a part of trough 206, such as part 206A. Inembodiments, part 206A has portions 206AA, 206AB, and 206AC. Inembodiments, portion 206AA and 206AC connect to portion 206AB, each atan angle, such that the length “N” is less than length “M.” Inembodiments, “N” may range from about 3 to 4 inches and “M” may rangefrom 4.5 to 5.5 inches. However, in alternate embodiments, differentdimension values may exist outside of these ranges. In embodiments, eachpart of trough 206, such as part 206A, may hold a pad 302. Inembodiments, portion 206AA may be viewed as the exterior of part 206Afrom outside cooling device 200 and, as such, the exterior of trough206.

FIG. 17 shows an example view of piping 214. As shown in FIG. 17, piping214 includes elbow 214A, pipes 214B, supply pipe 214C, adaptor 214D, andfitting 214E. In embodiments, pipes 214B are connected to each otherwith elbows 214A. In embodiments, supply pipe 214C is connected to pipes214B via elbows 214A.

FIG. 18 shows an example pipe 214B. In embodiments, pipe 214B may bemade of polyvinyl chloride (PVC), rubber, another type of plasticmaterial, a metal material, or a hybrid material. In embodiments, pipe214B may have entry-ways (e.g., holes) that allow a liquid (e.g., water)to be exerted over each pad 302 located within cooling device 200. Inembodiments, the liquid may be pressurized from an external source thatpumps water into pipe 214B. In embodiments, each entry-way may beequally spaced or may not be equally spaced.

FIG. 19 shows different views of pad 302. As shown in FIG. 19, pad 302may have sides 302A and 302B. In embodiments, side 302A has a dimensionmeasurement “Z.” In embodiments, “Z” may range from about 10 inches to16 inches. In embodiments, side 302B has dimension measurements of “X”and “W.” In embodiments, “X” and “W” may range from about 4 inches to 8inches. In alternate embodiments, the dimensions may be different andoutside the above noted ranges.

FIG. 20 shows an exploded view of corner 304. In embodiments, FIG. 20shows center 304A, plates 304B, and connectors 304C. In embodiments,center 304A may have a shape of a trapezoidal prism. In embodiments,corner 304 may be made of wood, metal, plastic, or of a hybrid material.In embodiments, plates 304B may be attached to sides of center 304A byusing connectors 304C through apertures within plates 304B and center304A. In embodiments, connectors 304C may be pins, screws, bolts,welding, and/or any other type of device for connecting two components.

FIG. 21 shows another exploded view of corner 304. FIG. 21 shows center304A, plates 304B, and connectors 304C.

FIG. 22 shows a schematic drawing of a pad, such as pad 302. As shown inFIG. 22, the pad has a pad thickness (P), a pad medium, an incoming airvelocity (u_(in)), an outgoing air velocity (u_(out)), incoming airtemperature (T_(in)), incoming air relative humidity (RH_(in)), outgoingair relative humidity (RH_(out)), incoming liquid flowrate (Q_(in)),outgoing liquid flowrate (Q_(out)), evaporation rate (m_(evap)), andsaturation of water (saturation_(water)).

In embodiments, the pad may be used in cooling device 200 and theparticular components of cooling device 200 as described in FIGS. 1B and2-21. In embodiments, the pad may utilize a cellulose material. Inembodiments, the pad medium and the pad thickness (P) may haveparticular dimensions that allow for the pad to provide for (1) atemperature decrease in air, such that T_(out) is less than T_(in), (2)an increase in relative humidity, such that RH_(out) is greater thanRH_(in), (3) a particular level of water saturation in the pad so thatthe pad does not dry out and also does not cause liquid mist to exit thepad, (4) an evaporation rate (m_(evap)) that ensures that T_(out) isless than T_(in) while maintaining a level of water saturation thatprevents the pad from drying out, (5) an incoming liquid flowrate(Q_(in)) that ensures that the pad is saturated with a level of liquid,such as water, while providing for a particular evaporation rate(m_(evap)) and an outgoing liquid flowrate (Q_(out)) which ensures thatT_(out) is less than T_(in) without resulting in (i) the pad from dryingout, and/or (ii) mist from exiting the pad, and/or (6) a relationshipbetween the change in temperature, from T_(out) and T_(in), and theamount of liquid saturation (e.g., saturation_(water)).

In embodiments, the thickness (P) of the pad may determine the size ofcover 204 and trough 206, as described in previous drawings. Inembodiments, the thickness (P) of the pad may determine the quantityliquid provided by piping, such as piping 214 as described in previousdrawings. In embodiments, the amount of liquid that flows from piping214 may determine the incoming liquid flowrate (Q_(in)). In embodiments,the outgoing air velocity (u_(out)) may be the same or similar to theincoming air flow (u_(in)). In embodiments, the outgoing air velocity(u_(out)) may be air, once passed across the pad, which circulateswithin trough 206 and then being pushed down by fan 202 as described inthe previous figures. In embodiments, the incoming air velocity (u_(in))may determine that evaporation of liquid occurs without “over carry.”“Over carry” occurs when a liquid leaves the pad, and is pushed by fan202, before there is evaporation of the liquid and which results inmist. In embodiments, liquid that does not evaporate will be outgoingliquid flowrate (Q_(out)) which will flow into trough 206.

FIG. 23 is a schematic drawing of cooling device 200 and fan 202. Inembodiments, FIG. 23 describes the incoming airflow velocity (u_(2in)),which is the air velocity that is exiting from a pad, such as the paddescribed in FIG. 22, and outgoing airflow (u_(2out)) which is airflowvelocity that is blown by fan 202 into an area. In embodiments, fan 202may rotate at a given rotations per minute (RPM), input fan power(E_(in)), and at a given fan pitch to provide the desired outgoingairflow from fan 202. In embodiments, the shape of cover 204 and trough206, described in earlier figures, may affect the incoming airflowvelocity into fan 202 and the outgoing airflow velocity exiting from fan202.

In embodiments, each incoming airflow associated with each incomingairflow velocity combines together (U_(TOTAL)) near or above fan 202,within the space created by combining cover 204 and trough 206, beforethen exiting fan 202 as an outgoing airflow (u_(2out)) associated withoutgoing airflow velocity. In embodiments, the fan motor may becontrolled by a computing device, as described in FIG. 25.

While the previous figures show pads 302, alternate embodiments ofcooling device 200 may not include any pads. Instead, cooling device 200may use an atomization process to distribute liquid within and aroundfan 202 within FIG. 2. In embodiments, atomization may be considered asa process of converting a liquid into very fine particles or droplets.Accordingly, in alternate embodiments, cooling device 200 may notinclude corners 304. Instead, cooling device 200 may have piping 214 toinclude particularly sized nozzles that receive liquid (e.g. via a pumpor other device) that, when exerted through openings in piping 214,result in the liquid being atomized. In embodiments, this results inatomized liquid being sprayed across fan 202. As a result, trough 206may not hold any water as the liquid is atomized and transferred awayfrom cooling device 200 by fan 202.

Also while the previous figures and embodiments show fan 202 operatingat the same time as a pump is providing liquid to pads 302, embodimentsmay have fan 202 operating only and no pump providing liquid to pads302. In embodiments, an electronic switch (e.g., on cooling device 200,on a remote wireless controller to cooling device 200, etc.) may switchthe operation of cooling device 200 so that it is only uses fan 202 andthe pump is not operating to provide liquid to pads 302. In alternateembodiments, another electronic switch may open and close cover 204.Thus, for example, if only fan 202 is operating, and not the pump, cover204 may be opened for additional air supply.

FIGS. 24A and 24B are diagrams of an alternate embodiment of coolingdevice 200, cooling device 2400. As shown in FIGS. 24A and 24B, coolingdevice 2400 may a ceiling rod 2402, shield 2404, pad 2406, float valve2408, and diffuser 2410. In embodiments, ceiling rod 2402 may allow forcooling device 2400 to be connected to a ceiling directly or indirectly.In embodiments, shield 2404 may cover pad 2406 in a manner similar topad cover 210 as described in previous figures.

In embodiments, pad 2406 may provide liquid to airflow in a mannersimilar to pad 302 as described in previous figures. In embodiments,float valve 2408 may be located in a trough-like structure, such astrough 206, as described in previous figures. In embodiments, diffuser2410 may connect to the bottom of cooling device 2400 and provide aparticular type of airflow distribution from cooling device 2400 to thearea surrounding cooling device 2400.

FIG. 25 is a diagram of example components of a cooling device 200.Device 2500 may correspond to computing devices that are part of coolingdevice 200 and/or a control system associated with cooling device 200.Alternatively, or additionally, fan 202 and/or the pump may include oneor more devices 2500 and/or one or more components of device 2500.

As shown in FIG. 25, device 2500 may include a bus 2510, a processor2520, a memory 2530, an input component 2540, an output component 2550,and a communications interface 2560. In other implementations, device2500 may contain fewer components, additional components, differentcomponents, or differently arranged components than depicted in FIG. 24.Additionally, or alternatively, one or more components of device 2500may perform one or more tasks described as being performed by one ormore other components of device 2500.

Bus 2510 may include a path that permits communications among thecomponents of device 2500. Processor 2520 may include one or moreprocessors, microprocessors, or processing logic (e.g., a fieldprogrammable gate array (FPGA) or an application specific integratedcircuit (ASIC)) that interprets and executes instructions. Memory 2530may include any type of dynamic storage device that stores informationand instructions, for execution by processor 2520, and/or any type ofnon-volatile storage device that stores information for use by processor2520.

Input component 2540 may include a mechanism that permits a user toinput information to device 2500, such as a keyboard, a keypad, abutton, a switch, etc. Output component 2550 may include a mechanismthat outputs information to the user, such as a display, a speaker, oneor more light emitting diodes (LEDs), etc.

Communications interface 2560 may include any transceiver-like mechanismthat enables device 2500 to communicate with other devices and/orsystems. For example, communications interface 2560 may include anEthernet interface, an optical interface, a coaxial interface, awireless interface, or the like.

In another implementation, communications interface 2560 may include,for example, a transmitter that may convert baseband signals fromprocessor 2520 to radio frequency (RF) signals and/or a receiver thatmay convert RF signals to baseband signals. Alternatively,communications interface 2560 may include a transceiver to performfunctions of both a transmitter and a receiver of wirelesscommunications (e.g., radio frequency, infrared, visual optics, etc.),wired communications (e.g., conductive wire, twisted pair cable, coaxialcable, transmission line, fiber optic cable, waveguide, etc.), or acombination of wireless and wired communications.

Communications interface 2560 may connect to an antenna assembly (notshown in FIG. 3) for transmission and/or reception of the RF signals.The antenna assembly may include one or more antennas to transmit and/orreceive RF signals over the air. The antenna assembly may, for example,receive RF signals from communications interface 2560 and transmit theRF signals over the air, and receive RF signals over the air and providethe RF signals to communications interface 2560. In one implementation,for example, communications interface 2560 may communicate with anetwork (e.g., wireless network, Internet, Intranet, etc.).

As will be described in detail below, device 2500 may perform certainoperations. Device 2500 may perform these operations in response toprocessor 2520 executing software instructions (e.g., computerprogram(s)) contained in a computer-readable medium, such as memory2530, a secondary storage device (e.g., hard disk, CD-ROM, etc.), orother forms of RAM or ROM. A computer-readable medium may be defined asa non-transitory memory device. A memory device may include space withina single physical memory device or spread across multiple physicalmemory devices. The software instructions may be read into memory 2530from another computer-readable medium or from another device. Thesoftware instructions contained in memory 2530 may cause processor 2520to perform processes described herein. Alternatively, hardwiredcircuitry may be used in place of or in combination with softwareinstructions to implement processes described herein. Thus,implementations described herein are not limited to any specificcombination of hardware circuitry and software.

No element, act, or instruction used in the present application shouldbe construed as critical or essential unless explicitly described assuch. Also, as used herein, the article “a” is intended to include oneor more items and may be used interchangeably with “one or more.” Whereonly one item is intended, the term “one” or similar language is used.Further, the phrase “based on” is intended to mean “based, at least inpart, on” unless explicitly stated otherwise.

In the preceding specification, various preferred embodiments have beendescribed with reference to the accompanying drawings. It will, however,be evident that various modifications and changes may be made thereto,and additional embodiments may be implemented, without departing fromthe broader scope of the invention as set forth in the claims thatfollow. The specification and drawings are accordingly to be regarded inan illustrative rather than restrictive sense.

What is claimed is:
 1. A cooling device, comprising: multiple corners; atrough; piping, wherein the piping includes piping sections; multiplepads, wherein the multiple pads are below the piping sections; and anaxial fan, wherein: the axial fan has blades that are located below themultiple pads, the axial fan has open space below the axial fan, and thetrough traverses around the axial fan without any part of the troughbeing directly below the axial fan.
 2. The cooling device of claim 1,wherein each of the multiple pads are perpendicular or parallel to otherpads of the multiple pads.
 3. The cooling device of claim 2, wherein theblades of the axial fan are adjacent to the trough.
 4. The coolingdevice of claim 3, wherein each of the piping sections are only parallelto the top surface of each of the multiple pads.
 5. The cooling deviceof claim 1, wherein the axial fan and its blades are level with a bottomsurface of the trough.
 6. A cooling device, comprising: a fan, whereinthe fan has open space directly below blades of the fan; a trough,wherein the trough traverses around the fan and is located below thefan, and wherein the blades of the fan are level with a bottom surfacethe trough; multiple connectors, wherein each of the multiple connectorsconnect to a front edge of the trough; and piping, wherein: the pipingincludes piping sections, and the piping sections are all above fan. 7.The cooling device of claim 6, further comprising: multiple pads,wherein each of the multiple pads are: located within multiple areaswhich are above the trough, located between two of the multipleconnectors, and located entirely below the piping.
 8. The cooling deviceof claim 6, further comprising: multiple corners, wherein each of themultiple corners include: a first part connected to a second part, and athird part is connected to the second part.
 9. The cooling device ofclaim 7, further comprising: pad covers, wherein each of the pad coversis: in front of each of the multiple pads, and without the pad coverstouching a bottom of the trough.
 10. The cooling device of claim 6,wherein each of the piping sections, located above each of the multiplepads, is only parallel to the top surface of each of the multiple pads.